JPS645896Y2 - - Google Patents
Info
- Publication number
- JPS645896Y2 JPS645896Y2 JP1983011605U JP1160583U JPS645896Y2 JP S645896 Y2 JPS645896 Y2 JP S645896Y2 JP 1983011605 U JP1983011605 U JP 1983011605U JP 1160583 U JP1160583 U JP 1160583U JP S645896 Y2 JPS645896 Y2 JP S645896Y2
- Authority
- JP
- Japan
- Prior art keywords
- plate
- heat dissipation
- groove
- circuit board
- power semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1160583U JPS59117165U (ja) | 1983-01-28 | 1983-01-28 | 電気回路の放熱構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1160583U JPS59117165U (ja) | 1983-01-28 | 1983-01-28 | 電気回路の放熱構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59117165U JPS59117165U (ja) | 1984-08-07 |
JPS645896Y2 true JPS645896Y2 (en]) | 1989-02-14 |
Family
ID=30143031
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1160583U Granted JPS59117165U (ja) | 1983-01-28 | 1983-01-28 | 電気回路の放熱構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59117165U (en]) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5713934Y2 (en]) * | 1978-09-02 | 1982-03-20 |
-
1983
- 1983-01-28 JP JP1160583U patent/JPS59117165U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59117165U (ja) | 1984-08-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4300371B2 (ja) | 半導体装置 | |
US5191512A (en) | Heat sink/circuit board assembly | |
JP2001168560A (ja) | 電子回路ユニット | |
JPS645896Y2 (en]) | ||
JPH11266090A (ja) | 半導体装置 | |
JPH0736468U (ja) | 電子部品の放熱構造 | |
JP2790044B2 (ja) | 電力増幅器の放熱実装構造 | |
JPH09213852A (ja) | 発熱電子部品の放熱構造 | |
JPH0927689A (ja) | 電子部品ユニット | |
JP2000252657A (ja) | 制御機器の放熱装置 | |
JPS6339976Y2 (en]) | ||
JPS6177349A (ja) | 混成集積回路の冷却方法 | |
JPS6127189Y2 (en]) | ||
JPS6325743Y2 (en]) | ||
JPH07307588A (ja) | モジュールの放熱構造 | |
JP2556436Y2 (ja) | 電子機器用筐体 | |
JPH0627956Y2 (ja) | 電子回路モジュール | |
JPH0655297U (ja) | モジュールの放熱構造 | |
JP2776366B2 (ja) | 電子部品の冷却構造 | |
JPH0343751Y2 (en]) | ||
JPH0429599Y2 (en]) | ||
KR920008837Y1 (ko) | 전기, 전자 제품의 방열판 | |
JP2570630Y2 (ja) | 放熱板 | |
JPH09116284A (ja) | 放熱器 | |
JPH0136366Y2 (en]) |